Title

Metallic glue for ambient environments making strides

Document Type

Article

Publication Date

1-1-2016

Subject Area

ARRAY(0x5577fa935b08)

Abstract

Advancements in nanoscience are making it possible to metallically glue two solids together at room temperature in air, and under a small amount of mechanical pressure. Metallic glues can serve as excellent conductors for heat dissipation and electrical current in electronic devices, as leak-resistant seals for vacuum environments. The potential market for these applications is extensive and growing rapidly.

Publication Title

Advanced Materials and Processes

Volume

174

Issue

1

First Page

22

Last Page

25

ISSN

08827958

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