In situ observation of microstrain relief in cold-sprayed bulk copper during thermal annealing

Authors

P. D. Eason, University of North FloridaFollow
S. C. Kennett, Colorado School of Mines
T. J. Eden, Pennsylvania State University
I. Krull, University of Florida
B. Kowalski, University of Florida
Jacob L. Jones, University of Florida

Document Type

Article

Publication Date

11-1-2012

Abstract

The thermal annealing behavior of copper produced by cold-spray processing was observed in situ using time-resolved X-ray diffraction during heating. The relief of microstrain is found to be coincident with the onset of grain refinement. Electron channeling contrast imaging was used to characterize grain size in pre-sprayed, sprayed and annealed conditions. Recrystallization of plastic flow regions adjacent to powder surfaces results in nanometer-sized grains, in contrast to larger grained recrystallized regions observed toward the center of the powder particles. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Publication Title

Scripta Materialia

Volume

67

Issue

9

First Page

791

Last Page

794

Digital Object Identifier (DOI)

10.1016/j.scriptamat.2012.07.029

ISSN

13596462

Citation Information

Eason, Kennett, S. ., Eden, T. ., Krull, I., Kowalski, B., & Jones, J. L. (2012). In situ observation of microstrain relief in cold-sprayed bulk copper during thermal annealing. Scripta Materialia, 67(9), 791–794. https://doi.org/10.1016/j.scriptamat.2012.07.029